BOARD ASSEMBLY

In our Castelfidardo headquarters there are two fully automated lines for the assembly and welding of components in Surface Mount Technology (SMT) capable of mounting all types of chips currently available on the market from 0201, including the MFF, BGA, CBGA, PBGA, CCGA, LGIA, with an average capacity of 50,000 components per hour.
Caltron also handles any type of process, from glue dispensation to double reflow on any surface.

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