Expert in manufacturing
Caltron Assembly deals primarily with the production of electronic circuit boards, wiring and systems for third-party companies.
Customers can take advantage of all the services needed for the entire manufacturing/creation of their products, including partial or total supply of materials.
BOARD ASSEMBLY
In our Castelfidardo headquarters there are two fully automated lines for the assembly and welding of components in Surface Mount Technology (SMT) capable of mounting all types of chips currently available on the market from 0201 , including the MFF, BGA, CBGA, PBGA, CCGA, LGIA, with an average capacity of 50,000 components per hour.
Caltron also handles any type of process, from glue dispensation to double reflow on any surface.
Caltron also handles any type of process, from glue dispensation to double reflow on any surface.
TESTING
The testing process takes place through the use of systems which are sized according to the specific needs of each customer.
Caltron is able to offer testing systems which range from simple bench tests with the use of generic instrumentation, tests performed with specialized systems specifically designed in collaboration with customers for analog / digital functional tests, power tests or through ICT systems.
Caltron is able to offer testing systems which range from simple bench tests with the use of generic instrumentation, tests performed with specialized systems specifically designed in collaboration with customers for analog / digital functional tests, power tests or through ICT systems.
SARTEC TECHNOLOGY
The operating plant located in Tunisia is specialized for completion and is set up with all the necessary equipment for the assembly and
welding of components in THT as well as being organized to perform ICT and functional tests.
It also has all that is required to perform SMT technology assembly, with machines and equipment specifically designed for the production of boards with low component density and in large quantities.
It also has all that is required to perform SMT technology assembly, with machines and equipment specifically designed for the production of boards with low component density and in large quantities.
MISSION
Caltron's mission is aimed at competitiveness in compliance with quality standards.
This goal is pursued through the optimization of production cycles and the search for new solutions, or alternative materials, as well as the specific use of Plant Sartec Technology.
We strive to develop an all-round collaboration with our customers, which transcends traditional Customer / Supplier relationship.
We consider ourselves a "Partner" and as such we face and, whenever possible, resolve any problem that may arise with a mutual goal in mind.
This goal is pursued through the optimization of production cycles and the search for new solutions, or alternative materials, as well as the specific use of Plant Sartec Technology.
We strive to develop an all-round collaboration with our customers, which transcends traditional Customer / Supplier relationship.
We consider ourselves a "Partner" and as such we face and, whenever possible, resolve any problem that may arise with a mutual goal in mind.
"Competitiveness in compliance with quality standards"
SMT lines
The SMT (Surface Mount Technology) process is currently the most widely used technology, thanks to the small size of components and the ability to solder them on both sides of the board. Our lines consist of a Loader, Screen Print, Pick & Place, Reflow Ovens, and Unloader. Rework stations and stand-alone control systems support the lines.
THT lines
The THT (Through-Hole Technology) process is one of the earliest technologies used for the production of electronic boards. It features components with leads that are inserted into the holes of the printed circuit board and soldered using dual-wave soldering machines. Component assembly on the PCB is performed through manual lines.
Testing and Control Devices
We perform essential process controls for process standardization, continuous improvement, and testing to ensure maximum reliability and adherence to specifications. Depending on requirements, we handle microprocessor programming, ICT testing with a bed-of-nails or Fly-Probe, combined with functional testing and 3D AOI (Automated Optical Inspection).
